Ultrasonic Mechanical Material Removal Process For Conductive And Non Metallic Meterial

Ultrasonic Mechanical Material Removal Process for conductive and non metallic Meterial

Technical Parameters:

Product shape: milling machine handle

Resonance point amplitude: 10um or more;

Speed: 3000 r / min or less

Matching tool: carbide end mill head Φ2-Φ13; disk cutter Φ50;

Power: 500W

Ultrasonic Machining

Ultrasonic assisted machining is a recently-developed technique, in which high-frequency (> 20 kHz) vibration is superimposed onto the movement of a standard drill bit in the axial direction, providing advantages including reduced drilling forces (reduction often in excess of 80%) and improved quality of drilled holes when compared to conventional drilling. Ultrasonic assisted drilling also achieves a reduction in entry and exit delamination size, but not in the expected proportion considering the observed reduction of drilling forces. A different mechanical process to that in conventional drilling may be driving the delamination in Ultrasonic assisted drilling, for example dynamic or thermal effects in addition to thrust and torque loads.

The aim of this project is to achieve a mechanical understanding of the process that drives delamination during Ultrasonic assisted drilling and to implement it in an analytical model and numerical tools with predictive ability. These can then be used to enhance Ultrasonic assisted drilling to minimise delamination and to predict the performance of hybrid joints with Ultrasonic assisted drilling-induced damage.

Principle:

Ultrasonic machining offers a unique blend of capabilities, quality and material compatibility for the machining of engineered ceramics and advanced technical materials. The process is versatile, offering flexibility to meet a wide range of design requirements, and yields high-quality parts with little or no subsurface damage and no heat-affected zone. These benefits make it a valuable resource for the scientists, engineers and designers who are developing tomorrow’s advanced technologies.

Applications

• Glass TRIANGULAR CAVITY
• Sapphire
• Alumina
• Ferrite
• PCD
• Piezoceramics
• Quartz
• CVD Silicon Carbide
• Ceramic Matrix Composites
• Technical Ceramics

Ultrasonic Mechanical Material Removal Process for conductive and non metallic Meterial

Workshop:

CE Certification:

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